Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 19B-13
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Host: Japan Institute of Electronics Packaging

Low temperature direct bonding of submicron Au pattern
*Teppei Imamura, Eiji Higurashi, Tadatomo Suga, Renshi Sawada
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Keywords: Surface activated bonding, Hybrid integration
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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