Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 19B-14
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Host: Japan Institute of Electronics Packaging

Low Temperature Bonding of CMP-Cu at Ambient Air Pressure
*Isamu Shoji, Akitsu Shigetou, Tadatomo Suga
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Keywords: surface activated bonding (SAB), CMP-Cu, ambient air pressure bonding, low temperature bonding
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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