The 22th JIEP Annual Meeting
Session ID : 19B-17
Conference information
Host: Japan Institute of Electronics Packaging
Development of Interconnect Technology in 25 Micron Pitch for Low Cost CoC(Chip on Chip)
*Takayuki Norimatsu, Masanori Natsuaki, Akira Takashima, Norio Kainuma, Takashi Kubota, Hidehiko Kira
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