The 22th JIEP Annual Meeting
Session ID : 19B-16
Conference information
Host: Japan Institute of Electronics Packaging
Development of Gold-Solder Flip-Chip in 40 Micro Pitch
*Fumihiko Ando, Akira Takashima, Nobuhiro Imaizumi, Yoshiyuki Satoh, Shuichi Takeuchi, Kenji Kobae, Hidehiko Kira, Kazuyuki Izumi, Yukinori Hatori, Takashi Ozawa
Author information
Keywords:
Gold-Solder Flip-Chip,
40 Micro Pitch
Details
