The 22th JIEP Annual Meeting
Session ID : 17C-02
Conference information
Host: Japan Institute of Electronics Packaging
Electroplating Technology for Through Silicon Via Copper Filling
*Akira Fukunaga, Mizuki Nagai, Nobutoshi Saito, Yuji Araki, Kenichi Akazawa, Fumio Kuriyama, Akira Owatari
Author information
Keywords:
Electroplating,
Through Silicon Via
Details
