Proceedings of JIEP Annual Meeting
The 22th JIEP Annual Meeting
Session ID : 17C-06
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Host: Japan Institute of Electronics Packaging

A highly-reliable multi-layer wafer-level Cu wiring technology with resin CMP
*Katsumi Kikuchi, Kouji Soejima, Hirokazu Honda, Shintaro Yamamichi
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Keywords: Wafer-level wiring, Polyimide, FCBGA
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[in Japanese]
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© 2008 by The Japan Institute of Electronics Packaging
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