Proposal of Low Cost Packaging Process

Abstract

Regarding the cost of semiconductro package, the substrate cost holds a big ratio. Therefore, to reduce the substrate cost, we developed the packaging process with using big area substrate. At this article, to realize the packaging process, we suggest the new mold method (VDCM: Vacuum Dip Compression Molding) and the method for the warpage reduction that is hard to depend on mold resin and structure of the product.