Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 13B-06
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Skeleton Circuit Structure(SCS)
*Hidetaka Hayashi
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Keywords: Ultimate Insulation Technology, Minimal material utilization, Printed Circuit
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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