Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 13B-07
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Metalizing to Polyimide with UV Modification
*Yosuke Iimori, Yoshiyuki Nishimura, Mitsuhiro Watanabe, Hideo Honma
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Keywords: UV, Electroless Plating, Polyimide
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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