Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 13B-08
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Quantitative Analysis of Metallic Elements in LSI Packages for IT equipment
*Katsuhito Nakazawa, Takafumi Hashitani
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Keywords: LSI Package, Metallic Element, Information Technology, Quantitative Analysis, Recycling
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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