Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11C-08
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Highly Acceleration Test on Lead-Free Solder
*Masaru Morita, Nobuyuki Hayashi, Teru Nakanishi, Yasuhiro Yoneda
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Keywords: highly acceleration test, lead-free solder, Sn-3.0Ag-0.5Cu, tin-lead solder, Coffin-Manson rule
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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