Abstract
The membrane used for circuit boards in operation switches is getting smaller due to the miniaturization of digital home appliances. Accordingly, the chip mounting area must be smaller. The chip mounting technique for the membrane normally uses the encapsulation resin to increase adhesion, but it obstructs the reduction of the mounting space. To satisfy downsizing requirements, a mounting method in which encapsulation resin is not used has been developed. Low melting point solder with resin was investigated, and it could perform good mounting property and downsizing the mounting area.
