Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11C-10
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Host: Japan Institute of Electronics Packaging

The 23th JIEP Annual Meeting
Development of Low Melting Point Sn-based Thin Film Solder for Fluxless Soldering
*Eiji Sakamoto, Shohei Hata, Hisashi Aoki, Toshiaki Koizumi, Hideaki Takemori, Kazuhiro Hirose
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Keywords: oxidation suppression, thin film solder, low melting point
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[in Japanese]
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© 2009 The Japan Institute of Electronics Packaging
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