Proceedings of JIEP Annual Meeting
The 23th JIEP Annual Meeting
Session ID : 11D-03
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The 23th JIEP Annual Meeting
Study on minute printed wiring board inspection system with Multi-probe
*Masanori Noguchi, Yukio Saito, Okitoshi Tsunoda, Tajima Takamitsu
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
An outward appearance inspection is used for the printed wiring board inspection but the reliability isn't enough. Because of the reliability improvement, the development of the inspection equipment that the wiring condition of the wiring can be at high speed confirmed is demanded. In this research, it developed a probe with dielectric to lose to do the turning on bad of the contact pin. It thought that the minute wiring could detect a minute flaw in doing precise positioning and taking a signal in the minute area.
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© 2009 The Japan Institute of Electronics Packaging
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