Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 11C-01
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Development of Composites Sheet using Epoxy Resin with Mesogen Molecular Groups
*Tomoo Nishiyama, Hiroyuki Takahashi, Hideyuki Katagi, Naoki Hara, yoshitaka Takezawa
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Keywords: Thermo Conductive, adhesion, insulation, epoxy resin
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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