Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 11C-02
Conference information

Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Study of Low CTE Technology to Reduce Warpage of FC-BGA
*Yoshihiro Nakamura, Kasumi Ikeba, Masaaki Takekoshi, Shinji Tsuchikawa, Jun-ichi Ozaki
Author information
Keywords: FC-PKG, warpage, Low coefficient of thermal expansion, nanosilica, copper clad laminate
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (329K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2010 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top