Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 12A-07
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Fatigue Failure Prediction of Solder Joints using Accumulated Damage Model
*Takeshi Terasaki, Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi
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Keywords: Solder Joint, Fatigue Life, Fatigue Crack Propagation, Finite Element Method
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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