Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 12A-10
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Effect of joining process on bondability of joints using Cu nanoparticle paste
*Tomoaki Hirano, Hiroshi Nishikawa, Tadashi Takemoto, Nobuto Terada
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Keywords: Pb-free, Cu nanoparticle paste, joining process, shear strength
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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