The 24th JIEP Annual Meeting
Session ID : 10DP-15
Conference information
Host: Japan Institute of Electronics Packaging
The 24th JIEP Annual Meeting
Temperature and Frequency Dependence of Fatigue Ductility Exponent and Coefficient of Sn-Ag-Cu Micro Solder
Keywords:
Fatigue Ductility Exponent,
Temperature Dependence,
Frequency Dependence,
Sn-Ag-Cu,
Miniature Test
Details
