Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 10DP-16
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Mechanical Properties of Low Ag contents Pb-Free Solder Alloys
*Hayato Isome, Kunihiro Zama, Yoshiharu Kariya, Hirohiko Watanabe, Noboru Hidaka, Tatsuhiko Asai
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Keywords: Low Ag solder, Low cycle fatigue, creep, miniature test
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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