Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 11A-10
Conference information

Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Investigation of electroless copper plating for low profile surface in SAP
*Satoru Shimizu, Aya Iwakiri
Author information
Keywords: electroless copper plating, low profile, semi-aditive, adhesion
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (201K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2010 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top