Proceedings of JIEP Annual Meeting
The 24th JIEP Annual Meeting
Session ID : 11A-11
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Host: Japan Institute of Electronics Packaging

The 24th JIEP Annual Meeting
Effect of Diallylamine System Additives for Copper Via Filling
*Hideyuki Kuri, Naoki Okamoto, Takeyasu Saito, Kazuo Kondo, Masaru Bunya, Minoru Takeuchi
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Keywords: Electrodeposition, Via Filling, Copper, Additives, Diallylamine
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[in Japanese]
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© 2010 The Japan Institute of Electronics Packaging
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