The 25th JIEP Annual Meeting
Session ID : 9B-05
Conference information
Host: Japan Institute of Electronics Packaging
The 25th JIEP Annual Meeting
PDN Impedance Evaluation of Decoupling Capacitor Embedded Interposer for 3D-Integrated LSI System
*Katsuya Kikuchi, Yutaka Akiyama, Kei Shimakura, Koichi Takemura, Toshio Gomyo, Toshikazu Okubo, Tetsuya Koyama, Tomoo Murakami, Masahiro Aoyagi, Kanji Otsuka
Author information
Keywords:
PDN Impedance Evaluation,
Decoupling Capacitor Embedded Interposer,
3D-Integrated LSI System
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