Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9B-06
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Warpage Prediction of Ball Grid Array Package Using a Homogenization Method
*Tomohisa Suzuki, Takeshi Terasaki, Toshiaki Tanaka, Masaaki Takekoshi
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Keywords: BGA, Warpage, Homogenization Method, Finite Element Method
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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