Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9C-04
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Packaging Technologies for Power Device
*Hiroshi Hozoji, Toshiaki Ishii, Toshiaki Morita, Yuusuke Yasuda
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Keywords: Power Module
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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