Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9C-07
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Fault Analysis of Soft Opens at TSVs by 3D Electromagnetic Simulation
*Shohei Kondo, Hiroyuki Yotsuyanagi, Masaki Hashizume
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Keywords: TSV, 3D IC, Open, Failure Analysis, Electromagnetic Simulation
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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