Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 9C-13
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Basic Examination of Metallization to Different Material Used for W-CSP by Electroless Plating Method
*Hiroshi Umemoto, Junki Oshikiri, Tatsunosuke Nakada, Akira Hashimoto, Ichiro Koiwa
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Keywords: Electroless Ni-P plating, Adhesion Force, Pretrestment
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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