Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10A-10
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
A Study on the Thermal Deformation and the Mechanical Properties Due to Curing Process of the Encapsulation Resin
*Hiroyuki Sato, Qiang Yu, Ryusuke Sone
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Keywords: resin
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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