Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10A-11
Conference information

Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Deformation of Resin Materials Due to the Curing in the Thermal process
*ryusuke sone, Qiang Yu, Hiroyuki Sato
Author information
Keywords: Curing, Resin, Thermal Deformation, Electronic Devices, Reliability
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (542K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2011 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top