Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 10A-12
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Micro-texture dependence of joint reliability of electroplated copper interconnections
*Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
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Keywords: Electroplated copper interconnection, Joint reliability, Microtexture, Migration, Strength of material
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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