The 25th JIEP Annual Meeting
Session ID : 10A-14
Conference information
Host: Japan Institute of Electronics Packaging
The 25th JIEP Annual Meeting
Location Prediction of Tin-Whiskers Generation during Thermal Cycle Test
*Takeshi Tearsaki, Takahiko Kato, Yasutaka Ookura, Tomio Iwasaki, Masato Nakamura, Hideki Ishii
Author information
Keywords:
Tin Whisker,
Tin Plating,,
Crystalline Orientation,
Electron Back-Scattering Pattern,
Finite Element Analysis
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