Proceedings of JIEP Annual Meeting
The 25th JIEP Annual Meeting
Session ID : 8DP-10
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Host: Japan Institute of Electronics Packaging

The 25th JIEP Annual Meeting
Basic Study on Metallization of Sin Film and Al Film on Si Substrate
*Junki Oshikiri, Tatunosuke Nakada, Hiroshi Umemoto, Akira Hashimoto, Ichirou Koiwa
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Keywords: Electroless plating
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[in Japanese]
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© 2011 The Japan Institute of Electronics Packaging
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