The 25th JIEP Annual Meeting
Session ID : 9A-07
Conference information
Host: Japan Institute of Electronics Packaging
The 25th JIEP Annual Meeting
A Study on Coaxial Line Structures with Printed Wiring Board Fabrication Technology Using Single Step Laminating Process
*Yoshiyuki Takasu, Katsuya Kikuchi, Hiroshi Nakagawa, Kohji Koshiji, Masahiro Aoyagi
Author information
Keywords:
printed wiring board,
coaxial line structure,
characteristic impedance,
high frequency characteristics,
three-dimensional electromagnetic field simulation
Details
