Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 7B-05
Conference information

The 26th JIEP Annual Meeting
Next Generation Power Device Module and Polymer Materials
*Akio Takahashi
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
Power semiconductor devices are key devices for carbon dioxide reduction technology.Here, we focus on the power semiconductor device module of automotive electronics field holding more than 50% of the power device market and introduce the optimum properties and the examples for polymer materials applying to the future power module.
Content from these authors
© 2012 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top