Proceedings of JIEP Annual Meeting
The 26th JIEP Annual Meeting
Session ID : 7B-06
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Host: Japan Institute of Electronics Packaging

The 26th JIEP Annual Meeting
Study on bismaleimide resin cured by phenolic resins
*Reo Takaiwa, Toshiyuki Oyama, Akio Takahashi
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Keywords: Heat resistant resin, Bismaleimide, Phenolic resin, Polymer alloy
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[in Japanese]
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© 2012 The Japan Institute of Electronics Packaging
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