Adhesive Mechanisms between Silver Nanoparticles Sintering Seed Layer and Copper Electroplating Layer

Abstract

We studied a technique of patterning method of Cu on polyimide film. The most important issue is adhesion strength between copper and polyimide film. We focused on the surface between silver nanoparticles sintering seed layer and copper electroplating layer. The adhesion strength was improved by surface treatment on silver nanoparticles sintering seed layer before copper electroplating. Then we use Hamaker constant as an indication of surface energy. In addition, the thickness, Vickers hardness and crystalline structure of copper electroplating layer on the printing pattern were the same everywhere by the most suitable surface treatment of silver nanoparticles sintering seed layer .