Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 6C-03
Conference information

Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Development of Restorable Thermosetting Resin for Sealing and Semiconductor Package
*Jun Nunoshige, Takahito Muraki, Satoru Amou, Hiroyuki Kagawa
Author information
Keywords: Sealant, living radical polymerization, Restoration, Healing, Alkylborane
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (682K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2014 The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top