Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7A-01
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The 28th JIEP Annual Meeting
A study on the Ultrasonic soldering of Aluminum
*Koji YamazakiTakeshi Araki
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Keywords: Aluminum, solder, ultrasonic
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Abstract
Recently, in the field of heat exchanger, we consider introducing lightweight and inexpensive aluminum (Al) instead of current copper(Cu) in response to the remarkable rise of the material price.Bonding method using a flux containing hydrofluoric acid highly corrosive torch and oven soldering in general have been taken in the bonding of Al far. But the flux needs to wash after using. If not removed, it becomes a cause of corrosion.So, we report basic research on the ultrasonic soldering of aluminum that is possible to fluxless soldering in the case of changing material(Cu/Al), soldering temperature, US application time, distance of Al sample and US horn.
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© 2014 The Japan Institute of Electronics Packaging
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