Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7B-04
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Study of Reliability Test Methods for Die-attach Joints on Power Semiconductors
*Kazunobu Arii, Yuichi Aoki, Kuniaki Takahashi
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Keywords: power semiconductor, power cycle test, die-attach, joints reliability, reliability test
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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