Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7B-05
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Fundamentals of Nucleation Mechanism of Electromigration in Metal Joints and Issues in Reliability
*Kimihiro Yamanaka
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Keywords: Solder, Joint, Electromigration, Metal, Reliability
CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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