Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7B-14
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Development of Bonding Technology and Die Bounding Equipment using Sintering Fine Metal Particles
*Yuzuru Kuramochi, Tadatomo Suga, Toshiyuki Shiratori, Masayuki Mizukoshi
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Keywords: power device, metal particles, sintering, die bonding
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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