Proceedings of JIEP Annual Meeting
The 28th JIEP Annual Meeting
Session ID : 7B-15
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Host: Japan Institute of Electronics Packaging

The 28th JIEP Annual Meeting
Plasma application for non-Pressurizing sintering type bonding tech
*Kazuya Kodani, Akira Sakamoto, Tsuyoshi Honda
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Keywords: plasma, pressureless, die bonding
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[in Japanese]
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© 2014 The Japan Institute of Electronics Packaging
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