Development of Ultra Thin Electroless Ni/Pd/Au Process for Fine-pitch Design

Abstract

We investigated the wire bonding reliability and the solder joint reliability of the electroless Ni/Pd/Au plating for semiconductor package substrate. The wire bonding reliability and the solder joint reliability decreased with decrease of the film thickness of electroless Ni plating. In order to solve these problems, we developed the ultra thin electroless Ni/Pd/Au process for fine-pitch design.