Conference -ACSIN-12&ICSPM21-
Metal-Metal Bonding Properties of Copper Oxide Nanoparticles
2014 Volume 12 Pages 105-108
Details
2014 Volume 12 Pages 105-108
The present study performs production of copper oxide particles, and examines the particles as a filler in metal-metal bonding. Leaf-like aggregates with a longitudinal size of ca. 600-950 nm and a lateral size of ca. 280-380 nm, which were composed of particles with a size of ca. 10 nm, were produced with a salt-base reaction using a Cu(NO3)2 aqueous solution and an NaOH aqueous solution. Copper discs were bonded by pressurizing them, between which the particles were sandwiched, at 1.2 MPa for 5 min in H2 gas under annealing at 400°C. Bonding properties of particles were evaluated by measuring shear strength, which was required to separate the discs. The shear strengths were as large as ca. 23 MPa at NaOH/Cu(NO3)2 ratios of 1.9 and 2.0, since CuO particles that contained nether Cu2(OH)3NO3 nor impurity based on the addition of NaOH were produced at the ratios. [DOI: 10.1380/ejssnt.2014.105]
