Abstract
CFCs had been used for a urethane thermal insulation for buildings and houses as foaming agents for a long time.But, use of CFCs, as forming agents, was prohibited in 1996 by “Montreal Protocol on Substances that Deplete the Ozone Layer”. Instead of using CFCs, HCFCs and HFCs have been used as foaming agents for the urethane thermal insulation. However, HCFCs and HFCs are concerned about as a material causing global warming because the global warming potential (GWP) of HCFCs and HFCs is more than several hundred times of the carbon dioxide. For that reason, we developed argon gas enclosure urethane foam for thermal insulation. Argon gas is free of the ozone depletion potential and the global warming potential, and a mechanical foaming technology is combined with. In this report, the mechanical forming technology, thermal conductivity of argon gas enclosure urethane foam for thermal insulation, and our future action are discussed.
