Development of the Insulation Method between PC and Large Tile using Screws

Part 3: Out-plane bending test

Abstract

The deformation followability of the anchor between the PC board and the tile was examined by conducting an out-of-plane three-point bending test of the PC board in which the large tile was integrated with the anchor and the back surface treatment material. The test piece has a difference between the back surface treatment material and the tiles. From the test results, the tiles of the test body did not crack at the bending angle of 1/600 of the design criteria. In addition, no mechanically significant difference was observed before and after the heat-accelerated deterioration assuming deterioration over time. Therefore, it is considered that the aged deterioration of the back surface treatment material and the sealing material has little influence on the displacement followability of this method. From the comparison between theoretical and experimental values, the tiles and PC boards were in a state close to stacked beams due to the backside treatment material. When there is no backside material, the tiles and PC board behave almost as if they were fully composite beams. Therefore, it is considered that the back surface treatment material is necessary to reduce the stress load on the tile