Fabrication and Thermal Insulation Performance of Mycelium-Based Composites for Thermal Insulation

Abstract

Mycelium-Based Composites (MBC), in which mycelium grows on and integrates lignocellulose substrates, are expected as a sustainable building thermal insulation that can replace conventional materials. In this paper, a fabricating experiment was conducted based on literature reviews to explore the optimal fabrication parameters for MBC. It was found that the spatial structure inside the material, which is determined by the shape of the substrates used and the molding method, affects the insulation performance by changing the degree of fungal growth and the void structure of the finished material. Measured by the transient line source method using a box type probe, lowest thermal conductivity of 0.0576 W/(m･K) was achieved for a sample prepared under high humidity (97%, 25°C) with long hemp fiber (10 mm) substrates and Ganoderma lucidum strains. By adjusting the manufacturing method, it is considered possible to approach 0.04W/(m･K), which is equivalent to that of plastic foam.