総説
半導体パッケージ基板用ビルドアップ材料
2011 年 84 巻 10 号 p. 321-325
詳細
2011 年 84 巻 10 号 p. 321-325
The build-up substrates are generally used for IC package. As the integration of semiconductor has increased, higher performance of insulation material is required for build-up substrates. In this article, the author explains the characteristics of build-up material required for IC package and latest technology trends for next generation.
