巻号一覧
84 巻, 10 号
選択された号の論文の9件中1～9を表示しています
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総説小特集 プリント配線板を支える高分子材料
巻頭言
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宮内 一浩2011 年 84 巻 10 号 p. 299
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーPDF形式でダウンロード (148K)
総説
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宮内 一浩2011 年 84 巻 10 号 p. 300
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーPDF形式でダウンロード (164K) -
高橋 昭雄2011 年 84 巻 10 号 p. 301-305
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーPersonal digital assistants (PDA), such as cellular phones, personal computers and car navigation systems, supporting the ubiquitous society, is expected to be the smart phones which have above mentioned all functions and evolve to ultimate wearable PDAs. High density LSI packaging technologies have been realized the superior performance and function of communication electronics products and printed wiring boards have played very important role to meet these requirements. Here, after brief introduction of the history and the categories, the technologies and the recent trend for the printed wiring boards are introduced, especially focusing on the thermosetting polymer materials. As the future prospect, we pay attention to the automotive electronics field, concretely the power device packaging technologies. High heat resistant and low thermal expansion resins such as polyaromatic epoxy resins, benzoxazine resins and cyanate resins for power semiconductor module are developed. Power semiconductor devices are key devices for carbon dioxide reduction technology. As another approach, the effective use of biomass resources as industrial materials plays an important role. Lignin is a plant biomass and is classified as a polyphenol and investigated a suitable alternative to fossil-fuel-derived phenol resins for use in the thermosetting epoxy resins.抄録全体を表示PDF形式でダウンロード (2509K) -
名越 俊昌, 田中 恵生, 福住 志津, 蔵渕 和彦2011 年 84 巻 10 号 p. 306-312
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーPhotosensitive solder resist for semiconductor package is now in transition stage. Smaller flip-chip burnp and finer bump pitch lead thinner solder resist with surface flatness and uniform thickness. In addition, the thickness precision is also important in the package. The demand of film type solder resist has been increasing against conventional liquid ink type one because of its ease to give flat surface. Additional advantage of the film type solder resist is that it is easy to disperse fine particle filler and remove fine foreign matters in the varnish because of the lower viscosity of the vanish comparing with that of conventiona1 liquid ink type solder resist. The solder resist of next generation requires the following properties: (1) Compatibility with direct image exposure, (2) Thinner film, (3) Fine pitch HAST resistance (line/space ≤ 8/8 μm), and (4) Crack resistance on various heat processes and TCT. In this paper, we introduce our approaches to satisfy these requirments such as preventing oxidation of underlying Cu which weakens the resistance to plating with thin thickness, greatly reducing contamination by Cl and Br, espetially hydrolyzable Cl, for HAST, and improving crack resistance by combination of new high Tg and low CTE resin and our elastomer technology.抄録全体を表示PDF形式でダウンロード (1346K) -
久保山 俊史2011 年 84 巻 10 号 p. 313-320
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーRecent trends of underfill resin for portable device were reviewed. In recent years, almost everyone in many countries has at least one or more portable devices such as mobile phone, smart-phone, and portable game consoles. Since these devices are often used under extremely severe condition for various purposes, they are required to have resistibility toward variety of physical and environmental stress. Underfill is one of the effective solutions to protect portable devices from troubles caused by these stresses. The requirements for physical and chemical properties of underfill resins and recent technologies used are described.抄録全体を表示PDF形式でダウンロード (867K) -
真子 玄迅2011 年 84 巻 10 号 p. 321-325
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーThe build-up substrates are generally used for IC package. As the integration of semiconductor has increased, higher performance of insulation material is required for build-up substrates. In this article, the author explains the characteristics of build-up material required for IC package and latest technology trends for next generation.抄録全体を表示PDF形式でダウンロード (668K)
研究論文
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塩山 務, 平原 英俊, 大石 好行, 成田 榮一, 森 邦夫2011 年 84 巻 10 号 p. 326-330
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーThe degraded interface layer between rubber and galvanized steel bonded with HRH (Hisile-Resorcinol-Hexamethylenetetramine) direct curing adhesion system was observed. After aging at 160 °C for 150 min with the hot press machine, the low sulfur-content layer existing near the interface was disappeared. It meant that the free sulfur migrated through the resorcinol-resin concentrated layer, which formed by the rubber vulcanizing process, and then reached to the metal surface. It may be suggested that the reaction of sulfur and surface metal brings the degradation of adhesion.
On the other hand, after aging test at 70 °C under RH 95% for 30 days, the resorcinol-resin concentrated layer existing near the interface was degraded. It was shown that the degradation came mainly from the scission of resin-rubber bond, as the results of aging tests of SBR/ Zinc powder /RH model compounds.抄録全体を表示PDF形式でダウンロード (780K) -
塩山 務, 平原 英俊, 大石 好行, 成田 榮一, 森 邦夫2011 年 84 巻 10 号 p. 331-335
発行日: 2011年
公開日: 2012/03/27
ジャーナル フリーThe adhesion degradation of rubber/galvanized-steel direct bonding system was accelerated by moisture. The route that moisture reached the rubber/galvanized-steel interface through, and improvement of stability of the adhesion system was studied.
Following results were obtained. (1) The moisture does not penetrate through the rubber/metal interface, but through the rubber bulk phase. (2) Of the rubber components, emulsion-polymerized SBR shows the highest amount of moisture adsorption. So compounding solution-polymerized rubber as main material instead of emulsion-polymerized rubber, the adhesion stability under high moisture condition was remarkably improved.抄録全体を表示PDF形式でダウンロード (811K)
紹介
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2011 年 84 巻 10 号 p. Annc10_315
発行日: 2011年
公開日: 2012/03/27
ジャーナル 認証ありPDF形式でダウンロード (230K)
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