Abstract
Backgrind tape (BG tape) is widely used in semiconductor process to protect wafer surface as well as to prevent wafer crack. Among those tapes employed in industries, BG tape can be characterized by high precision in thickness and clean design by controlling both foreign and residual contaminations. BG tape is composed of base film and adhesive covered by release film. For base film, EVA, PET or other layered materials have been used. Some special materials were also reported for well contacting bumpy wafer surface. Adhesive is designed with acrylate in general, and material design should be cared to reduce residue. UV-curable adhesive is also used. In the technology that wafer thickness becomes thinner, BG tape will compete with other materials. Design of BG tape should be further investigated for handling ultra-thin wafer with facility.
